View HLMP-3950-LM0VR_3825760.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

features improved brightness improved color performance available in popular t-1 and t-1 3 / 4 packages new sturdy leads ic compatible/low current capability reliable and rugged choice of 3 bright colors high efficiency red high brightness yellow high performance green applications lighted switches backlighting front panels light pipe sources keyboard indicators description these non-diffused lamps out-perform conventional led lamps. by utilizing new higher intensity material, we achieve superior product performance. the hlmp-3750/-3390/-1340 series lamps are gallium arsenide phosphide on gallium phosphide red light emitting diodes. the hlmp-3850/-3490/ -1440 series are gallium arsenide phosphide on gallium phosphide yellow light emitting diodes. the hlmp-3950/-3590/-3960/-1540/-d640/-k640 series lamps are gallium phosphide green light emitting diodes. hlmp-3707, -3807, -3907; hlmp-3750, -3850, -3950, -3960 hlmp-3390, -3490, -3590; hlmp-1340, -1440, -1540 hlmp-d640; hlmp-k640 hlmp-3707 t-1 3 / 4 (5 mm), t-1 (3 mm), ultra-bright led lamps data sheet
2 selection guide luminous intensity iv (mcd) @ 20ma package device package description color hlmp- min. typ. max. 2 q 1/2 degree outline t-1 3 / 4 red 3707-l00xx 90.2 - - 24 f 3750 90.2 125.0 - 24 a 3750-l00xx 90.2 125.0 - 24 a yellow 3807-k00xx 96.2 - - 24 f 3850 96.2 140.0 - 24 a 3850-k00xx 96.2 140.0 - 24 a 3850-kl0xx 96.2 150.0 294.0 24 a green 3907-k00xx 111.7 - - 24 f 3914-k00xx 111.7 - - 24 d 3950 111.7 265.0 - 24 a 3950-k00xx 111.7 265.0 - 24 a 3950-lm0xx 170.0 300.0 490.0 24 a 3960-k0xxx 111.7 265.0 - 24 e emerald green d640-e00xx 6.7 21.0 - 24 d t-1 3 / 4 low profile red 3390 35.2 55.0 - 32 b yellow 3490 37.6 55.0 - 32 b 3490-i00xx 37.6 55.0 - 32 b green 3590 43.6 55.0 - 32 b 3590-i00xx 43.6 55.0 - 32 b t-1 red 1340 35.2 55.0 - 45 c 1340-h00xx 8.6 15.0 27.6 45 c 1340-j00xx 35.2 55.0 - 45 c 1340-jk0xx 35.2 55.0 112.8 45 c yellow 1440 23.5 45.0 - 45 c 1440-h00xx 23.5 45.0 - 45 c 1440-hi0xx 23.5 - 75.2 45 c 1440-hib00 23.5 - 75.2 45 c green 1540 27.3 45.0 - 45 c 1540-h00xx 27.3 45.0 - 45 c 1540-ij0xx 43.6 60.0 139.6 45 c emerald green k640 4.2 21.0 - 45 c k640-d00xx 4.2 21.0 - 45 c k640-fgnxx 10.6 20.0 34.0 45 c
3 25.40 (1.00) min. 6.10 (0.240) 5.59 (0.220) 2.54 (0.100) nom. 9.19 (0.362) 8.43 (0.332) 5.08 (0.200) 4.57 (0.180) cathode lead (note 1) 0.89 (0.035) 0.64 (0.025) 1.27 (0.050) nom. 0.102 (0.004) max. typ. 0.46 (0.018) square nominal package outline "d" hlmp-d640 22.86 (0.900) min. 6.10 (0.240) 5.60 (0.220) 2.54 (0.100) nom. 9.07 (0.357) 8.56 (0.337) 5.08 (0.200) 4.78 (0.188) 0.89 (0.035) 0.64 (0.025) 1.52 (0.060) 1.02 (0.040) 0.10 (0.004) max. 0.74 (0.029) 0.58 (0.023) square 12.47 (0.491) 11.71 (0.461) 1.02 (0.040) max. cathode flat ? package outline "e" hlmp-3960 23.0 (0.900) min. 6.10 (0.240) 5.60 (0.220) 9.07 (0.357) 8.56 (0.337) 5.08 (0.200) 4.78 (0.188) 0.89 (0.035) 0.64 (0.025) 1.52 (0.060) 1.02 (0.040) 0.53 (0.021) 0.43 (0.017) 13.11 (0.516) 12.34 (0.486) 1.02 (0.040) max. epoxy meniscus cathode flat package outline "f" hlmp-3707/-3807/-3907 sq. 2.79 (0.110) 2.29 (0.090) 1.32 (0.052) 1.02 (0.040) package dimensions
4 absolute maximum ratings at t a = 25 c parameter red yellow green/emerald green units peak forward current 90 60 90 ma average forward current [1] 25 20 25 ma dc current [2] 30 20 30 ma transient forward current [3] 500 500 500 ma (10 s pulse) reverse voltage (i r = 100 a) 5 5 5 v led junction temperature 110 110 110 c operating temperature range -55 to +100 -55 to +100 -20 to +100 c storage temperature range -55 to +100 notes: 1. see figure 2 to establish pulsed operating conditions. 2. for red and green series derate linearly from 50 c at 0.5 ma/ c. for yellow series derate linearly from 50 c at 0.2 ma/ c. 3. the transient peak current is the maximum non-recurring peak current the devices can withstand without damaging the led die a nd wire bonds. it is not recommended that the device be operated at peak currents beyond the absolute maximum peak forward current. hlmp - x x xx - x x x xx mechanical options 00: bulk 01: tape & reel, crimped leads 02, bx: tape & reel, straight leads a1, b1: right angle housing, uneven leads a2, b2: right angle housing, even leads dx, ex: ammo pack, straight leads fh: 2 iv bin select with inventory control vx: ammo pack, crimped leads color bin options 0: full color bin distribution b: color bin 2 & 3 only n: color bin 6 & 7 only maximum iv bin options 0: open (no. max. limit) others: please refer to the iv bin table minimum iv bin options please refer to the iv bin table color options 3, 7: gap her 4, 8: gap yellow (except k4xx series) 5, 9: gap green 6: gap emerald green package option 1, k: t-1 (3 mm) 3, d: t-1 3 / 4 (5 mm) part numbering system
5 electrical/optical characteristics at t a = 25 c t-1 3 / 4 test symbol description t-1 3 / 4 low dome t-1 min. typ. max. units conditions peak peak 37xx 3390 1340 635 nm measurement wavelength 38xx 3490 1440 583 at peak 39xx 3590 1540 565 d640 k640 558 d dominant 37xx 3390 1340 626 nm note 1 wavelength 38xx 3490 1440 585 39xx 3590 1540 569 d640 k640 560 ? 3 / 4 spectral line 37xx 3390 1340 40 nm halfwidth 38xx 3490 1440 36 39xx 3590 1540 28 d640 k640 24 s speed of 37xx 3390 1340 90 ns respond 38xx 3490 1440 90 39xx 3590 1540 500 d640 k640 3100 c capacitance 37xx 3390 1340 11 pf v f = 0, 38xx 3490 1440 15 f = 1 mhz 39xx 3590 1540 18 d640 k640 35 r j-pin thermal 37xx 3390 210 c/w junction to resistance 38xx 3490 210 cathode lead 39xx 3590 210 d640 510 1340 290 1440 290 1540 290 k640 290 v f forward 37xx 3390 1340 1.5 1.9 2.6 v i f = 20 ma voltage 38xx 3490 1440 1.5 2.1 2.6 (figure 3) 39xx 3590 1540 1.5 2.2 3.0 d640 k640 2.2 3.0 v r reverse 37xx 3390 1340 5.0 v i f = 100 a breakdown 38xx 3490 1440 voltage 39xx 3590 1540 d640 k640 v luminous 37xx 3390 1340 145 lumens note 2 efficacy 38xx 3490 1440 500 watt 39xx 3590 1540 595 d640 k640 655 notes: 1. the dominant wavelength, l d, is derived from the cie chromaticity diagram and represents the single wavelength which defines the color of the device. 2. the radiant intensity, ie, in watts per steradian, may be found from the equation ie = iv/ h v , where iv is the luminous intensity in candelas and h v is the luminous efficacy in lumens/watt.
6 figure 1. relative intensity vs. wavelength. red, yellow, and green figure 4. relative luminous intensity vs. forward current. figure 5. relative efficiency (luminous intensity per unit current) v s. peak current. high efficiency red wavelength ?nm relative intensity 1.0 0.5 0 500 550 600 650 700 yellow emerald green green t = 25?c a figure 2. maximum tolerable peak current vs. pulse duration. (i dc max as per max ratings). figure 3. forward current vs. forward voltage.
7 figure 6. relative luminous intensity vs. angular displacement. t-1 3 / 4 lamp. figure 7. relative luminous intensity vs. angular displacement. t-1 3 / 4 low profile lamp. figure 8. relative luminous intensity vs. angular displacement. t-1 lamp. intensity range (mcd) color bin min. max. red g 9.7 15.5 h 15.5 24.8 i 24.8 39.6 j 39.6 63.4 k 63.4 101.5 l1 01.5 162.4 m1 62.4 234.6 n2 34.6 340.0 o3 40.0 540.0 p5 40.0 850.0 q8 50.0 1200.0 r 1200.0 1700.0 s 1700.0 2400.0 t 2400.0 3400.0 u 3400.0 4900.0 v 4900.0 7100.0 w 7100.0 10200.0 x 10200.0 14800.0 y 14800.0 21400.0 z 21400.0 30900.0 maximum tolerance for each bin limit is 18%. intensity bin limits
8 lambda (nm) color cat # min. max. emerald green 9 552.5 555.5 855 5.5 558.5 755 8.5 561.5 656 1.5 564.5 green 6 561.5 564.5 556 4.5 567.5 456 7.5 570.5 357 0.5 573.5 257 3.5 576.5 y ellow 1 582.0 584.5 358 4.5 587.0 258 7.0 589.5 458 9.5 592.0 559 2.0 593.0 orange 1 597.0 599.5 259 9.5 602.0 360 2.0 604.5 460 4.5 607.5 560 7.5 610.5 661 0.5 613.5 761 3.5 616.5 861 6.5 619.5 maximum tolerance for each bin limit is 0.5 nm. color categories intensity range (mcd) color bin min. max. ye llow h 26.5 42.3 i 42.3 67.7 j 67.7 108.2 k10 8.2 173.2 l17 3.2 250.0 m25 0.0 360.0 n36 0.0 510.0 o51 0.0 800.0 p8 00.0 1250.0 q 1250.0 1800.0 r 1800.0 2900.0 s 2900.0 4700.0 t 4700.0 7200.0 u 7200.0 11700.0 v 11700.0 18000.0 w 18000.0 27000.0 green/ a 1.1 1.8 emerald b 1.8 2.9 green c 2.9 4.7 d4.7 7.6 e7 .6 12.0 f 12.0 19.1 g 19.1 30.7 h 30.7 49.1 i 49.1 78.5 j 78.5 125.7 k12 5.7 201.1 l20 1.1 289.0 m28 9.0 417.0 n41 7.0 680.0 o6 80.0 1100.0 p 1100.0 1800.0 q 1800.0 2700.0 r 2700.0 4300.0 s 4300.0 6800.0 t 6800.0 10800.0 u 10800.0 16000.0 v 16000.0 25000.0 w 25000.0 40000.0 maximum tolerance for each bin limit is 18%. intensity bin limits (continued)
9 mechanical option matrix mechanical option code definition 00 bulk packaging, minimum increment 500 pcs/bag 01 tape & reel, crimped leads, min. increment 1300 pcs/bag for t-1 3 / 4 , 1800 pcs/bag for t-1 02 tape & reel, straight leads, min. increment 1300 pcs/bag for t-1 3 / 4 , 1800 pcs/bag for t-1 a1 t-1, right angle housing, uneven leads, minimum increment 500 pcs/bag a2 t-1, right angle housing, even leads, minimum increment 500 psc/bag b1 t-1 3 / 4 , right angle housing, uneven leads, minimum increment 500 pcs/bag b2 t-1 3 / 4 , right angle housing, even leads, minimum increment 500 psc/bag bj t-1, tape & reel, straight leads, minimum increment 2000 pcs/bag eg ammo pack, straight leads in 5 k increment fh devices that require inventory control and 2 i v bin select vr ammo pack, crimped leads, min. increment 2 k for t-1 3 / 4 and t-1 note: all categories are established for classification of products. products may not be available in all categories. please contact your local avago representative for further clarification/information.
precautions lead forming the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering conditions care must be taken during pcb assembly and soldering process to prevent damage to led component. the closest led is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. recommended soldering conditions: wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. if necessary, use fixture to hold the led component in proper orientation with respect to the pcb during soldering process. proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 25 c, before handling. special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. recommended pc board plated through hole sizes for led component leads: manual solder w ave soldering dipping pre-heat temperature 105 c max. pre-heat time 30 sec max. peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max. led component plated through lead size diagonal hole diameter 0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm (0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch) 0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm (0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch) note: refer to application note an1027 for more information on soldering led components. figure 8. recommended wave soldering profile. laminar wave bottom side of pc board hot air knife turbulent wave fluxing preheat 01020 30 50 100 150 200 250 30 40 50 time ?seconds temperature ? c 60 70 80 90 100 t op side of pc board conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150 c (100 c pcb) solder wave temperature = 245 c air knife air temperature = 390 c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma note: allow for boards to be sufficiently cooled before exerting mechanical force. 10
for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies limited in the united states and other countries . data subject to change. copyright ? 2006 avago technologies limited. all rights reserved. obsoletes 5989-2810en 5989-4254en may 24, 2006

▲Up To Search▲

Price & Availability of HLMP-3950-LM0VR

	To Download HLMP-3950-LM0VR Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .